SU1300SU1300 with a micro porous polyurethane structure is designed to create the flawless surface during “Chemical Mechanical Polishing” (CMP)process for wafer planarization. Its special continuous structure, eventually, makes the pad become an easy tool to offer a better performance on excellent removal rate, good localized planarization and high global uniformity.furthermore, the pressure can be evenly shared by its continuous cell configuration and thus offer a low defect. High hardness increases its ability on stock removal rate. Such quality makes SU1300 an ideal pad for
many different buffing processes.

 

SD1750A

 

SF400

 

SH1380A

 

SC1535D

 

SF800

 

GFM

 

GP1500

 

GP1800

 

IT1340D

 

IT1580A

 

SF400

 

SF800