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SU1300SU1300 with a micro porous polyurethane structure is designed to create the flawless surface during “Chemical Mechanical Polishing” (CMP)process for wafer planarization. Its special continuous structure, eventually, makes the pad become an easy tool to offer a better performance on excellent removal rate, good localized planarization and high global uniformity.furthermore, the pressure can be evenly shared by its continuous cell configuration and thus offer a low defect. High hardness increases its ability on stock removal rate. Such quality makes SU1300 an ideal pad for
many different buffing processes. |
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